“Huawei is emulating Apple in developing the processors that power its latest smartphone,” reports Ars Technica, “a breakthrough that will help the Chinese company to reduce its reliance on foreign technology as it confronts US sanctions.”
Analysis of the main chip inside the Mate 60 Pro smartphone, which launched at the end of last month and immediately sold out, reveals that Huawei has joined the elite group of Big Tech companies capable of designing their own semiconductors. Four of the eight central processing units in the Mate 60 Pro’s “system on a chip” (SoC) rely purely on a design by Arm, the British company whose chip architecture powers 99 percent of smartphones. The other four CPUs are Arm-based but feature Huawei’s own designs and adaptations, according to three people familiar with the Mate’s development and Geekerwan, a Chinese technology testing company that took a closer look at the main chip…
While Huawei is still licensing Arm’s basic designs, its own HiSilicon chip design business has improved on them to build its own processor cores on the Mate’s Kirin 9000S SoC. This will give it the flexibility needed to produce high-end smartphones despite the constraints of US export controls, said analysts and industry insiders. The Kirin 9000S also features a graphics processing unit and neural processing unit developed by HiSilicon. Its predecessor, the Kirin 9000 SoC, had relied completely on Arm for its CPUs and GPU…
Huawei was able to produce its own phone processors by adapting CPU core designs that were originally used in its data center servers, according to people with direct knowledge of its development. The strategy resembles Apple’s moves to turn its iPhone processors into chips capable of powering its Mac computers — but in reverse. “No one ever did this before,” said analyst Brady Wang of Counterpoint Research of Huawei’s server-to-phone innovation…
Various testing teams, including Geekerwan’s, have found that Huawei’s semiconductor capabilities are one to two years behind those of chips made by the US’s Qualcomm, the leading mobile chipmaker. Huawei’s chips also consume more power than its competitors’, according to measurements, and can cause the phone to heat up.
Reuters reports that “The United States has no evidence that Huawei can produce smartphones with advanced chips in large volumes, U.S. Commerce Secretary Gina Raimondo said on Tuesday.”
But meanwhile, a Huawei Technologies unit “is shipping new Chinese-made chips for surveillance cameras, in a fresh sign the Chinese tech giant is finding ways around four years of U.S. export controls, two sources briefed on the unit’s efforts said.”
The shipments to surveillance camera manufacturers from the company’s HiSilicon chip design unit started this year, according to one of the sources, and a third source familiar with the industry supply chain. One of the sources briefed on the unit said at least some of the customers were Chinese…
“These surveillance chips are relatively easy to manufacture compared to smartphone processors,” said the source familiar with the surveillance camera industry’s supply chain, adding that HiSilicon’s return would shake up the market… Before the U.S. export controls, it was the dominant chip supplier to the surveillance camera sector, with brokerage Southwest Securities estimating its global share in 2018 at 60%. By 2021, HiSilicon’s global market share plummeted to just 3.9%, according to data from consulting firm Frost & Sullivan…
TechInsights analyst Dan Hutcheson said their analysis of the Mate 60 Pro and other components such as its radio frequency power chip also suggested that Huawei had access to sophisticated electronic design automation (EDA) tools that “they are not supposed to have”.
“We don’t know if they got them illicitly, or more probably the Chinese developed their own EDA tools,” he said.
Thanks to long-time Slashdot reader AmiMoJo for sharing the news.
Read more of this story at Slashdot.
Source: Slashdot – Huawei’s New SoC Features Processor Cores Designed In-House
