Intel Details New 9th Gen CPUs for Notebooks: i9-9980HK to i5-9300H

Intel is yet has to announce its 9th Gen Core processors for laptops officially, but because the company needs to sort out all the things with authorities and regulators well in advance of actual product launches, CPU model numbers and general specifications have been published well ahead of the formal release. As it turns out, recently the company disclosed the first details about its 9th Gen mobile Core i9, Core i7, and Core i5 H-series processors for higher-end laptops.

Before proceeding to the actual products, let us make it clear what Intel actually revealed. Among other things, Intel (and other companies) has a number of export compliance metrics for its CPUs, including GFLOPS, Adjusted Peak Performance (APP), and Composite Theoretical Performance (CTP). These metrics are used by various governments to determine capabilities of CPUs and other processors. The APP and GFLOPS metrics are used by the US Department of Commerce’s Bureau of Industry and Security (BIS). Meanwhile, other authorities and regulators use CTP calculations, which are stated in Millions of Theoretical Operations Per Second (MTOPS), to assess what companies import to their countries. The CTP numbers are the ones that Intel published for its yet-to-be released CPUs.

The mobile CPUs newly listed are the eight-core Core i9-9980HK processor with unlocked multiplier, the eight-core Core i9-9880H, the eight-core Core i7-9850H, the eight-core Core i7-9750H, the quad-core Core i5-9400H, and the quad-core Core i5-9300H. All of them are aimed at high-performance laptops for gamers and professionals and, according to Intel, will be launched in the second quarter. Since the new processors belong to Intel’s 9th Gen Core family are designed to feature hardware mitigations against specific Meltdown and Spectre vulnerabilities. Meanwhile, a quick look at the basic specs that Intel published as well as their CTP numbers can shed some light on general specifications of the upcoming 9th Gen Core H-series mobile processors.

Intel 9th Gen Core CPUs for Desktops and High-End Notebooks
Tier Model Application Cores Base



i9 i9-9900K Desktop 8 / 16 3.6 GHz 5.0 GHz 16 MB UHD 630 1200 95 W
i9-9900KF Desktop 8 / 16 3.6 GHz 95 W
i9-9980HK Notebook 8 / 16 ? UHD 630 (?) ? ?
i9-9880H Notebook 8 / 16 ? 4.8 GHz ? ?
i7 i7-9700K Desktop 8 / 8 3.6 GHz 4.9 GHz 12 MB UHD 630 1200 95 W
i7-9700KF Desktop 8 / 8 3.6 GHz 4.9 GHz 95 W
i7-9850H Notebook 8 / 8 ? 4.6 GHz UHD 630 (?) ? ?
i7-9750H Notebook 8 / 8 ? 4.5 GHz ? ?
i5 i5-9600K Desktop 6 / 6 3.7 GHz 4.6 GHz 9 MB UHD 630 1150 95 W
i5-9600KF Desktop 6 / 6 3.7 GHz 4.6 GHz 95 W
i5-9400 Desktop 6 / 6 2.9 GHz 4.1 GHz UHD 630 1050 65 W
i5-9400F Desktop 6 / 6 2.9 GHz 4.1 GHz 65 W
i5-9400H Notebook 4 / 8 ? 4.3 GHz 8 MB UHD 630 (?) ? ?
i5-9300H Notebook ? 4.1 GHz ? ?
i3 i3-9350KF Desktop 4 / 4 4.0 GHz 4.6 GHz 91 W
i3-9100 Desktop ? ? 4.2 GHz 6 MB UHD 630 (?) ? ?

NOTE 1: Keep in mind that Intel has only published very basic specificationsof its upcoming 9th Gen Core CPUs for notebooks (i.e., Turbo frequency and cache size), which is why a number of details published here (e.g., core count, iGPU) are not confirmed officially at this point.

Obviously, the Core i9-9980HK and the Core i9-9980H will sit on top of the range offering eight cores with Hyper-Threading, 16 MB of L3 cache as well as Turbo frequencies close to their desktop counterparts. Meanwhile, the difference between CTP of desktop Core i9 and notebook Core i9 CPUs clearly indicates that their base clocks will be considerably lower, possibly to maintain a 45 W TDP.

Intel’s Core i7-9850H and the Core i7-9750H processors will sit below their Core i9-branded brethren. These chips will feature eight cores (without HT) capable of running at up to 4.6 GHz along with 12 MB of L3 cache. Just like in case of higher-end parts, these CPUs will be clocked considerably lower than their desktop colleagues.

Surprisingly, as far as the cache size and CTP numbers are concerned, the 9th Gen Core i5 H-series processors will not feature six cores, but will pack four Hyper-Threaded cores with 8 MB of L3. While the Core i5-9300H chip will probably run faster than the Core i5-8300H, the Core i5-9400H will have exactly the same base frequency as the Core i5-8400H as they have the same CTP of 254,167 MTOPS.

In addition to mobile CPUs, Intel also disclosed some preliminary details about its entry-level quad-core Core i3-9100 CPU in its document. The chip will run at frequencies of up to 4.2 GHz and will feature 6 MB of L3 cache. Since this is a lower-end part, expect it to be priced accordingly.

As always, Intel does not comment on unreleased products, so take every unconfirmed spec mentioned here with a grain of salt. What we do know for sure at this point is that Intel has finalized specs of its 9th Gen Core H-series processors for laptops and, if everything goes as planned, is on track to launch them in Q2 2019.

NOTE 2: The screenshot of Intel’s document above has been altered in order to better represent the topic of the news story. The original document looks as follows:

Related Reading

Source: Intel (via momomo_us Twitter)

Source: AnandTech – Intel Details New 9th Gen CPUs for Notebooks: i9-9980HK to i5-9300H

Newegg Lists ASUS ROG Dominus Extreme Motherboard, More Xeon CPUs Supported

One of the interesting elements to Intel’s unlocked 28-core Xeon W-3175 processor launch was that the motherboard options to support this processor were minimal. At present only ASUS and GIGABYTE have shown designs for it, and the GIGABYTE model is still a few months from production. As a result, most reviewers ended up with the ASUS ROG Dominus Extreme for the chip. At the time of the launch, the MSRP for this motherboard was not yet determined – ASUS had told us that the units they had shipped were only to OEMs at this point, and they were still looking into retail availability. Ultimately in our review, we guessed that the motherboard would be around $1500. It would appear that Newegg is now listing the motherboard at $1800.

Source: AnandTech – Newegg Lists ASUS ROG Dominus Extreme Motherboard, More Xeon CPUs Supported

Samsung Unveils Galaxy Tab S5e: 10.5-Inch sAMOLED with USB-C

Samsung today introduced its new mid-range Google Android-based tablet. Despite its formal positioning for consumers, the Galaxy Tab S5e features a rather large 10.5-inch sAMOLED display, a decent SoC, plenty of memory as well as storage, an advanced audio sub-system, a USB Type-C connector, and even compatibility with Samsung’s DeX platform for productivity applications. In general, the new tablet from Samsung brings together a decent performance, a good display, compatibility with productivity apps, compact dimensions, and a relatively low price – a rather interesting combination that we have not encountered before.

The Samsung Galaxy Tab S5e is powered by an unidentified SoC that integrates two 64-bit high-performance cores, six 64-bit energy-efficient cores, and an unknown iGPU. It is possible that the application processor was developed by Samsung itself, but at this point this is a speculation. The SoC is accompanied by 4 or 6 GB of DRAM and 64 or 128 GB of NAND flash storage (expandable by 512 GB using a microSDXC card). The tablet is outfitted with a 10.5-inch Super AMOLED display with a 2560×1600 resolution and thin bezels, similar to the one found on a considerably more expensive Galaxy Tab S4, but presumably without a stylus support. Imaging capabilities of the device comprise of a 13 MP rear sensor as well as an 8 MP front sensor.

When it comes to wireless connectivity features of the Galaxy Tab S5e, they include an 802.11ac Wi-Fi controller with MU-MIMO support, and Bluetooth 5.0. Samsung says that models with a 4G/LTE modem will be available later. Since the product is aimed at consumers, not road warriors, prioritizing the launch of Wi-Fi-only versions makes sense for the manufacturer. As for wired I/O, the Galaxy Tab S5e is outfitted with a USB 3.1 Type-C interface for audio, data, and charging, as well as a set of POGO connectors for keyboards or some other gear.

Like all good tablets these days, the Galaxy Tab S5e has a rather vast set of sensors, including an accelerometer, a gyroscope, a proximity sensor, a fingerprint scanner, a geomagnetic sensor (a compass), an RGB light sensor, and so on. The sensors can detect how the tablet is held (or placed) and then Samsung’s software automatically adjusts its quad-speaker audio sub-system co-designed with AKG for the best possible experience.

Designed primarily with consumers in mind, the Galaxy Tab S5e is very light and compact. It weights 400 grams and is just 5.5 mm thick, which is considerably lighter and thinner when compared to most 10-inch class tablets. Despite its rather humble z-height, the tablet packs a 7,040 mAh battery that provides up to 14.5 hours of battery life, according to the manufacturer.

Samsung Galaxy Tab S5e
SoC 2 × high-performance cores at 2.0 GHz

6 × energy-efficient cores at 1.7 GHz
Graphics unknown
Display 10.5-inch


Storage 64 GB or 128 GB

+ microSD up to 512 GB
Memory 4 GB or 6 GB LPDDR4 (?)
Wireless Wi-Fi 802.11 a/b/g/n/ac 2.4G+5GHz, VHT80 MU-MIMO, Wi-Fi Direct, Bluetooth v5.0
GPS GPS, Glonass, Beidou, Galileo
Connectivity USB 3.1 Type-C for data and charging

POGO connectors for keyboard
Camera Rear Camera: 13 MP Autofocus (?)

Front Camera: 8 MP Fixed Focus (?)
Video Recording: UHD 4K (3840×2160) @ 30fps

Playback: UHD 4K (3840×2160) @ 60fps
Audio 4 × Speakers co-developed with AKG with Dolby Atmos certification

USB-C headset
Sensors Accelerometer, Fingerprint Sensor, Gyro Sensor, Geomagnetic Sensor, Hall Sensor, RGB Light Sensor
Battery 7040 mAh

Up to 14.5 hours
Dimensions 245 × 160 × 5.5 mm

400 grams (Wi-Fi)
Color  Silver, Black, Gold
OS Android 9.0 Pie
Price starts at $399.99
Accessories Book cover Keyboard, POGO Charging Dock, Slim cover, Book cover (not included)

One interesting feature of the consumer-oriented Galaxy Tab S5e is its support for Samsung’s DeX platform that enables desktop-like experience on Android-based tablets (e.g., open up multiple windows, re-size windows, drag and drop content, etc.). Obviously, to take full advantage of DeX, users will need the optional Book Cover Keyboard that is sold separately. In the meantime, Samsung does not indicate that users may attach the tablet to a full-sized display using a USB Type-C to HDMI adapter if more screen real estate is needed, so this capability will likely remain exclusive to more expensive Galaxy Tab devices. Besides, the Galaxy Tab S5e also does not support Samsung’s Knox mobile security platform to protect valuable and confidential information, which is pretty logical given its positioning.

Samsung plans to start sales of its Galaxy Tab S5e in the second quarter of 2019 starting at $399.99. To increase the value of the product, Samsung will include a 4-months YouTube Premium subscription and a 3-months Spotify Premium subscription with the device (at least where available). 4G/LTE-enabled models will follow on later this year, their pricing is unknown.

Related Reading:

Source: Samsung

Source: AnandTech – Samsung Unveils Galaxy Tab S5e: 10.5-Inch sAMOLED with USB-C

Playing Chicken: Kentucky Fried Intel Core i9-9900KFC Processor Listed

If every letter has a special meaning for a feature in a product, and a product portfolio offers a mix and match of those features, then eventually a combination of letters will end up with a secondary meaning. Today we’re seeing the beginning of the Kentucky Fried version of Intel: in the latest changelog to AIDA64, a well-known utility for system identification and testing, the company behind the software has added in the hooks and details for the Core i9-9900KFC.

This CPU is as-yet unannounced by Intel. Software houses like the one behind AIDA, as well as OEMs, have to design software (and hardware) in advance of future products, and so they need to know the specifications and details in advance as well. It just so happens that sometimes those parts get listed in updates and changelogs, which is the case here.

No other details other than the name are given, although we can infer a few things. Intel’s K processor line means that the processor will be overclockable, and the i9-9900 means that it will be using the fastest speeds of the generation. F processors are new to Intel’s lineup, and mean that the processor doesn’t have integrated graphics, and users will need a discrete graphics card to use the chip.

The letter causing confusion however, is the C. In the past, Intel used ‘C’ to designate the Broadwell CPUs that had improved integrated graphics. This would fly in the face of the ‘F’ part of the name. However, those C processors also contained a small amount of eDRAM to act as a buffer between the L3 cache and the CPU. In our testing of those processors, it only really gave extra performance to integrated graphics workloads, which is where those Broadwell processors were focused.

But if the naming holds true here, then Intel might be set to offer eDRAM on its high-end eight core processors. Given that we saw benchmark performance increases only on a couple of benchmarks, it will be interesting to hear what Intel has to say about the added benefits are here. Having a non-integrated graphics part with extra hardware to improve graphics performance is like a double edged sword, except with no swords and two hilts.

But at least it is deep fried and from Kentucky, right? This chip needs some dip.

We’ve reached out to the people behind AIDA, and Intel, for extra clarity on this processor.

Related Reading

Source: AnandTech – Playing Chicken: Kentucky Fried Intel Core i9-9900KFC Processor Listed

Western Digital’s RISC-V "SweRV" Core Design Released For Free

Western Digital has published a register-transfer level (RTL) design abstraction of its in-house designed SweRV RISC-V core. The SweRV core is one of several RISC-V projects the company as undertaken as part of their effort to spearhead the ISA, its ecosystem, and foster their own transition away from licensed, royalty-charging CPU cores. In accordance with the more open design goals of RISC-V, the publication of the high-level representation of SweTV means that third parties can use it in their own chip designs, which will popularize not only the particular core design, but also the RISC-V architecture in general.

Source: AnandTech – Western Digital’s RISC-V “SweRV” Core Design Released For Free

ID Cooling Unveils IS-30 Low-Profile 30-mm Cooler for 100 Watt CPUs

ID Cooling has introduced its new CPU cooling system for ultra-thin computers, such as those that come in thin mini-ITX or mini-STX form-factors. The IS-30 cooler is only 30-mm tall and is designed to cool processors with TDPs up to 100 Watts. Formally, this means the IS-30 is rated ot handle even eight-core unlocked processors, such as Intel’s Core i9-9900K or AMD’s Ryzen 2700X.

Source: AnandTech – ID Cooling Unveils IS-30 Low-Profile 30-mm Cooler for 100 Watt CPUs

The Acer Nitro 5 Gaming Laptop Review: Absolutely AMD – Ryzen Plus Polaris

Today we are taking a look at the Acer Nitro 5, which is one of the least expensive ways to get into a gaming laptop. Acer offers several models, with the lowest cost offering coming in at just $669.99 MSRP, while the top of this range capping out at $999.99. Regardless of the price range you are looking at, all of the Acer Nitro 5 models offer pretty reasonable feature set, with a dGPU at least 8 GB of RAM, and other than the lowest-priced tiers, SSD storage as well. There’s a lot of laptop here for the price, and Acer has options for this entire end of the market with the Nitro 5.

Source: AnandTech – The Acer Nitro 5 Gaming Laptop Review: Absolutely AMD – Ryzen Plus Polaris

NVIDIA Earnings Report Q4 2019: Crypto Pain But Full Year Gain

This afternoon, NVIDIA announced their earnings for the fourth quarter of their 2019 fiscal year, which ended January 27. As expected, revenues were sharply hit by the crash of the cryptocurrency markets, and the Santa Clara company faced a year-over-year revenue drop of $706 million, or 24%, with fourth-quarter revenues of $2.2 billion. Gross margin fell to 54.7%, down 7.2% from Q4 2018. Operating income was down a dramatic 73% to $294 million, although net income was only down 49%, coming in at $567 million. This resulted in diluted earnings-per-share of $0.92, down 48% from a year ago.

NVIDIA Q4 2019 Financial Results (GAAP)
  Q4’2019 Q3’2019 Q4’2018 Q/Q Y/Y
Revenue $2205M $3181M $2911M -31% -24%
Gross Margin 54.7% 60.4% 61.9% -5.7% -7.2%
Operating Income $294M $1058M $1073M -72% -73%
Net Income $567M $1230M $1118M -54% -49%
EPS $0.92 $1.97 $1.78 -53% -48%

For the full fiscal year though, earnings were still very solid, with revenue up 21% to $11.7 billion, and an overall gross margin of 61.2%, up 1.3% from 2018. Operating income was $3.8 billion, up 19%, and net income was $4.1 billion, up 36%. Earnings-per-share for all of 2019 came in at $6.63, 38% higher than 2018.

NVIDIA’s growth thanks to Cryptocurrency was mostly found in their gaming GPU lineup sales, so unsurprisingly the GPU business saw the biggest revenue drop of any segment. Year-over-year, NVIDIA’s GPU business fell 20%, and compared to the previous quarter, it’s down 29%. Still, the GPU side of the house still brought in $1.98 billion in revenue.

Tegra is the other business unit, and it had revenues of only $225 million, down 50% from a year ago. Tegra includes automotive, SoCs for consoles, and embedded devices, and NVIDIA states that most of this decline is due to declines in gaming platforms.

Breaking the units down into markets, Gaming continues to be the biggest segment of NVIDIA, although not by the wide margin we are accustomed to. Gaming brought in $954 million in revenue, down 45% from a year ago where Gaming was $1.7 billion in revenue.

Professional Visualization was up 15% from Q4 2018, with revenues of $293 million, and Automotive was up 23% to $163 million. OEM and IP was down 36% though, thanks to the drop in SoC sales for consoles.

Datacenter continues to be a growth market for NVIDIA, with revenue up 12% to $679 million, encroaching on Gaming as the highest revenue segment for the company. Clearly they’ve done well to diversify and create product segments for the datacenter, and it pays extra dividends when your core business has a weak quarter like this one.

NVIDIA Quarterly Revenue Comparison (GAAP)

($ in millions)
In millions Q4’2019 Q3’2019 Q4’2018 Q/Q Y/Y
Gaming $954 $1764 $1739 -46% -45%
Professional Visualization $293 $305 $254 -4% +15%
Datacenter $679 $792 $606 -14% +50%
Automotive $163 $172 $132 -5% +23%
OEM & IP $116 $148 $180 -31% -24%

For Q1 2020, NVIDIA is expecting revenues to be $2.2 billion, plus or minus 2%, with gross margins between 58.3% and 59.3%.

It will likely take a couple more quarters to get a feel for how everything has shaken out with the decline in Crypto GPU purchases clearly hitting the company hard. NVIDIA has made some pretty major gains that have certainly taken a beating, but they do have some new products on the market currently which might help alleviate the situation.

Source: NVIDIA Investor Relations

Source: AnandTech – NVIDIA Earnings Report Q4 2019: Crypto Pain But Full Year Gain

EKWB Begins Selling Heatsink for Intel’s Optane 905P M.2 SSD

EK Water Blocks has started selling its passive heatsink for Intel’s recently-released Optane 905P M.2 SSD. The cooling solution is meant to ensure consistent performance of the drive under high loads. Previously the cooler was available only with the drive purchased from Newegg, but from now on it will be available more widely.

Source: AnandTech – EKWB Begins Selling Heatsink for Intel’s Optane 905P M.2 SSD

Plugable USBC-NVME Tool-Less NVMe SSD Enclosure Capsule Review

Storage bridges are an important part of computing systems. Currently popular external bridges allow storage drives (hard drives or SSDs) to talk to computing systems over USB or Thunderbolt 3. While Thunderbolt 3 is a premium Intel-only interface for now, USB 3.1 Gen 2 has emerged as a credible mass-market high-performance alternative. We recently reviewed the MyDigitalSSD M2X M.2 NVMe SSD Enclosure that allows a PCIe NVMe SSD to be accessed over USB. Today, we will be looking at another product having the same functionality – the Plugable USBC-NVME. The key difference lies in the industrial design of the casing, allowing the M.2 SSD to be installed without the need for any tools. Its thermal characteristics are different. Read on for our detailed analysis.

Source: AnandTech – Plugable USBC-NVME Tool-Less NVMe SSD Enclosure Capsule Review

HOYA Starts to Build Next-Gen HDD Glass Substrate Production Facility

HOYA Corp., an optical glass maker from Japan, announced this week that it had started construction of its new production facility for hard drive platter glass substrates. These substrates could be used to make conventional 2.5-inch HDD platters as well as next-generation platters for hard drives that use energy-assisted magnetic recording technologies (HAMR, MAMR).

The manufacturing facility will cost HOYA around ¥30 billion ($270.5 million) and will start production at the beginning of 2020, according to a media report. Located in the Saysettha Development Zone (SDZ) in Laos, the factory will be HOYA’s third plant that produces glass substrates for hard drives. Being the newest one, the facility will use the latest manufacturing equipment and technologies, so it will be ready to make the most advanced substrates that will then be used by makers of platters (e.g., Seagate, Showa Denko, Western Digital) to manufacture next-gen HDD media. HOYA’s other substrate manufacturing capacities are located in Thailand, and Vietnam.

Nowadays glass substrates for HDD platters are mainly used to make media for 2.5-inch hard drives for laptops and datacenters. As sales of 2.5-inch HDDs for notebooks are dropping because of cheaper SSDs, demand for these platters and substrates is decreasing as well. In the meantime, the use of glass substrates and platters in 3.5-inch drives is gaining traction as makers of datacenter HDDs start to use them both for existing and next-gen hard drives that use energy-assisted recording technologies. Glass substrates have a number of advantages when compared to aluminum substrates: they are thinner, lighter, more rigid, they expand less than aluminum when heated, and they may be made flatter. In the end, they are more preferrable for next-gen high-capacity HDDs.

Contemporary hard drives featuring perpendicular magnetic recording (PMR) technology use aluminum or glass media featuring CoCrPt–SiO2 nanogranular magnetic films. Researchers believe that next-gen HDDs that use ultra-high-density energy-assisted recording technologies (such as HAMR or MAMR) will have to switch to new types of media featuring magnetic materials with high magnetocrystalline anisotropy (such as L10–FePt, L10– CoPt, Nd2Fe14B, and SmCo5) particularly because the structure of the new media will have to ensure that grains used to record data are small enough, whereas the media takes into account extreme temperatures and other factors that occur during heat-assisted recording.

Scientists think that since rare earth compounds are susceptible to oxidation and corrosion, they are not suitable for long-term data storage. They consider a combination of a glass substrate and L10–FePt as the most promising one for HAMR-based HDD media at the moment.

Keeping in mind that sales of high-capacity hard drives for exascale datacenters are increasing, demand for glass substrates (with certain properties) for next-gen HDDs is almost guaranteed, which is why HOYA is investing in the new facility.

*See Ultra-High-Density Magnetic Recording: Storage Materials and Media Designs by Gaspare Varvaro and Francesca Casoli published by CRC Press

Related Reading:

Source: Xinhua

Image Credits: HOYA, Western Digital, Ultra-High-Density Magnetic Recording: Storage Materials and Media Designs by Gaspare Varvaro and Francesca Casoli published by CRC Press

Source: AnandTech – HOYA Starts to Build Next-Gen HDD Glass Substrate Production Facility

LG Teases G8 Audio Capabilities: Confirms OLED Display

Starting last year, LG seems to have made a marketing strategy out of teasing features about their upcoming flagship devices. LG continues this strategy with today’s reveal of an interesting aspect about the upcoming LG G8 ThinQ, which we expect to be unveiled at MWC in Barcelona on February 24th.

For the G7, LG had teased the capabilities of the new generation LCD screen, revealing its brightness characteristics as well as its customisation options. While the screen was indeed very bright, it was rather handicapped by bad colour calibration as well as high base power consumption. The LG V40’s OLED screen showed great picture quality characteristics, however again suffered from even worse base power consumption issues, resulting in quite disappointing battery life results of the phone.

Today’s teaser announcement addresses two things: the main point is LG disclosing about the audio speaker design of the G8, while inadvertently confirming the screen technology of the upcoming flagship.

The new screen/audio technology is called “Crystal Sound OLED”. In essence, LG is using the display assembly and front glass as a speaker diaphragm in order to provide a better audio experience. Based on LG’s description of the feature, it sounds (pun intended) that this display speaker will be optimised for higher frequencies, while we’ll still have a traditional bottom firing main speaker that will take care of lower frequencies such as bass.

Interestingly, LG describes this setup as capable of stereo 2-channel output. This is achieved thanks to the display speaker exciter being located at the top of the phone, opposite the main bottom speaker. Stereo output was something I criticised the LG G7 on as its sound directionality was something the phone lacked in, so I’m glad LG is attempting to address this.

Even though the sound solution is interesting, the most important aspect of today’s announcement is the fact that LG is confirming that the G8 will be coming with an OLED display. LG has attempted OLED phones in the past, but most had mixed results. The company and has had some success in establishing it as a feature of the V-series starting with the V30, but still lagged behind Samsung Display in terms of quality.

The issue is that up till today LG hadn’t managed to deliver a device that didn’t have some picture quality issues all while delivering competitive power efficiency. The LG V40’s OLED screen had addressed the picture quality concerns, however it still showcased vast power issues – something that most of 2018’s phones with LG OLED displays suffered from, in varying degrees of severity, ranging from the Pixel 3, to Huawei’s Mate 20 Pro.

With the confirmation that the G8 will be coming with an OLED display, this marks the first time that LG has decided to use the technology in the G-series. This is an important distinction for the company as the G-series is LG’s “mainstream” flagship with global availability, compared to the more limited market strategy of the V-series. Subsequently, it will be important for LG to get the OLED screen right without any compromises.

We’re looking forward to get our hands on the G8 ThinQ and will be reporting about it at LG’s launch event on the 24th.

Related Reading:

Source: AnandTech – LG Teases G8 Audio Capabilities: Confirms OLED Display

Intel Submits Ireland Fab Expansion Plan: $8 Billion Price Tag, With a 4 Year Lead Time

Intel has submitted a proposal to Irish authorities for the expansion of its manufacturing site near Leixlip. According to the plans, Intel is exploring the construction of a brand-new building – one larger than their previously proposal – which in particular strongly hints that the chipmaker would be installing EUV lithography equipment.

Intel originally received permission to build its new fab on the west-side of its Leixlip campus back in 2017. However the company never began construction, as it did not have a strategic plan in place for boosting manufacturing capacities. Last year the company formally decided to significantly boost its manufacturing capacities by building new fabs in Oregon, Ireland, and Israel, as well as to furnish its Fab 42 in Arizona. These expansions are being undertaken in a bid to ramp up Intel’s capacity for their forthcoming 7 nm process, which relies on a combination of DUV and EUV lithography tools. But first, Intel needs to get permission from the local authorities, which is why it recently submitted its plans to Kildare County Council and was picked up by a local newspaper.

The proposed fab will reportedly take four years to build and will cost Intel around $8 billion. The company expects that the new production facility will employ 1600 people after it becomes fully operational. Importantly, this long cycle means that even if Intel started this year (and they likely won’t), the fab would not be completed until 2023. So it’s widely expected that Intel would be preparing the fab for 7 nm EUV, if not a more advanced manufacturing process. This new fab would in turn be joining Intel’s existing fab in Leixlip, which currently makes chips using the company’s 14 nm process technology.

Now that Intel has formally submitted its expansion plans to local authorities, it will take the latter some time to approve it. Therefore, according to the local media, Intel would start any actual construction “over the next year or so”. This, of course, is assuming the plan even makes it that far; the formal submission of the plan does not mean that Intel will build the fab, as the company’s intentions tend to change with the market. While Intel has a roadmap for its global manufacturing network expansion, it still needs approval from local authorities before the company can commit money to the project.

Alll told, the Irish fab is the latest in a series of fab plans from Intel. Besides the four fabs in Arizona, Ireland, Israel, and Oregon, Intel is also in talks to build another $11 billion fab in Israel.

Related Reading:

Sources: Intel, Intel, The Irish Times

Source: AnandTech – Intel Submits Ireland Fab Expansion Plan: Billion Price Tag, With a 4 Year Lead Time

Samsung's 2019 QLED UHD TVs: 8K TVs Revamped, 4K TVs Get New Panel & Backlighting

Samsung this week formally introduced its 2019 Ultra-HD TV family. The new high-end televisions from Samsung all feature QLED backlighting and compared to their 2018 predecessors, have received audio and video quality enhancements. Select models will also get AMD’s FreeSync variable refresh rate tech along with Samsung’s Game Motion Plus tech to remove blur and judder in fast-paced scenes. Finally, along with the new hardware, all of the new Smart TVs (as well as those launched in 2018) will receive the iTunes Movies & TV Shows app and Apple AirPlay 2 support (as reported), along with the new Universal Guide that is designed to allow users to discover content more quickly.

Samsung Q900: 8K King of the Hill

Samsung’s Q900 series will remain the company’s top-of-the-range lineup, offering an 8K (7680×4320) resolution and coming in 65, 75, 82, 85, and 98-inch sizes. This year’s Samsung Q900-series televisions will be based on a version of the Quantum Processor 8K (briefly described last year) that not only upscales content to an 8K res, but optimizes “audio and video to the specific content” as well as tailors audio settings for the particular environment.

Samsung QLED 4K: Premium UHD TVs Get Better

At the 4K level, Samsung’s premium Q90 and Q80 lineups of 4K Ultra-HD TVs will get new panels, which are said to feature wider viewing angles (which the maker does not quantify), less glare, and better color reproduction. The latter would appear to be courtesy of a revamped backlighting system featuring quantum dots, as well as precision-controlled LEDs to enhance contrasts, which along with the Q90 and Q80 series TVs, will also be coming to the Q70 series.

Meanwhile, starting with this year’s models, Samsung’s QLED 4K TVs will be powered by the Quantum Processor 4K that upscales content to a 3840×2160 resolution and enhances its quality through various other algorithms.

Samsung QLED Lifestyle 4K: Ultra HD with Style

For customers who not only want a QLED-based Ultra-HD television but also want a completely different take on how those TVs should be styled, Samsung is rolling out its QLED Lifestyle 4K lineup. This consists of The Frame and The Serif models, where the former support interchangeable bezels (sold separately), and the latter is equipped with a stylish “post-modern” frame. Both can display various works of art that can be obtained from Samsung’s Art Store in Ambient Mode (that is supported by all of Samsung’s QLED 4K TVs).

4K UHD RU: Pure 4K

Last but not least, Samsung will also keep offering 4K Ultra-HD TVs without quantum dot-enhanced backlighting. The RU8000-series televisions will come in 49, 55, 65, 75, and 82-inch sizes, whereas the cheaper RU7100-series will feature 43, 49, 55, 58, 65, and 75-inch diagonals. Interestingly, the company will offer only two curved 4K models: the R7300-series in 55 and 65-inch sizes.

Samsung’s 2019 4K and 8K UHD TVs
Lineup Product Series Sizes Processor Distinctive Features
QLED 8K Q900

65”, 75”, 82”, 85”, 98”
Quantum Processor 8K (2019 version?) 8K, new SoC

65”, 75”, 82”
Quantum Processor 4K Ultra Viewing Angle: reduces glare and enhances color.

Direct Full Array: enhances contrast with precision-controlled LED backlighting


55”, 65”, 75”, 82”

49”, 55”, 65”, 75”, 82”
Direct Full Array: enhances contrast with precision-controlled LED backlighting

43”, 49”, 55”, 65”, 75”, 82”
QLED Lifestyle 4K The Frame

43”, 49”, 55”, 65”
Interchangeable bezels, Samsung Art Store
The Serif

A bold, post-modern design
4K UHD RU RU8000

49”, 55”, 65”, 75”, 82”
? ?

55”, 65”

43”, 49”, 55”, 58”, 65”, 75”

Ultra Large TVs Gain Popularity

One of the things that catches our eyes with Samsung’s 2019 Ultra-HD TV lineup is the number of ultra-large displays, which measure 75 inches and higher. According to Samsung, which cites data from IHS Markit, there were 2.1 million 75-inch+ TVs sold in 2018. Furthermore, the market for such devices is expected to grow by 43% this year to 3 million units, before reaching 5.8 million units in 2022. As a result, with their latest generation of TVs Samsung is looking to capitalize on the demand for such large televisions by offering more ultra-large models than ever before.

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Source: Samsung

Source: AnandTech – Samsung’s 2019 QLED UHD TVs: 8K TVs Revamped, 4K TVs Get New Panel & Backlighting

Advantech Unveils 32 GB SQRAM DDR4 DIMMs for HPC

Advantech, a maker of server-grade memory, storage, and other components and solutions, is introducing a new lineup of 32 GB unbuffered DDR4 memory modules. Designed for high-performance computing (HPC) applications, the SQRAM-brand DIMMs use the latest DDR4 DRAM devices from Samsung, and feature additional reinforcements to make them suitable for industrial applications.

Advantech’s SQRAM 32 GB DDR4 modules are based on Samsung’s 16 Gb DDR4-2666 memory chips. Given their positioning, they enable system makers to easily install 64 GB of memory into machines with two memory slots or 128 GB of memory into machines with four memory slots, twice what’s possible with today’s common 16 GB DIMMs. Advantech’s modules come in ECC Unbuffered DIMMs, Unbuffered SO-DIMM, ECC SO-DIMM, and Rugged DIMM form-factors.

Advantech’s SQRAM DDR4-2666 Lineup
Family Capacity Form-Factor Temperatures

4 GB – 32 GB Unbuffered



SQR-UD4N/I (ECC) ECC Unbuffered DIMM 0~85℃

SQR-YD4N/I Rugged DIMM 0~85℃


Along with class-leading capacity for an unbuffered DIMM, Advantech’s SQRAM-brand memory modules are also aimed at applications that require high long-term reliability. In particular, they’re rated to withstand extreme temperature ranges (between -40°C and +85°C or between 0°C and +85°C), and they feature 30u micron thick golden connectors for extra reliability. The modules also come equipped with a heatsink and are supported by the company’s SQRAM Manager utility to monitor DRAM temperature and alert about overheating.

Advantech will start sales of its 32 GB SQRAM DDR4-2666 memory modules in the near future. The company hasn’t announced any official prices at this time, but as both high-capacity and industrial-grade DIMMs, they are very much high-end parts and will undoubtedly be priced accordingly.

Related Reading:

Source: Advantech

Source: AnandTech – Advantech Unveils 32 GB SQRAM DDR4 DIMMs for HPC

Exploring Thunderbolt 3 eGFX Performance, Feat. PowerColor's Gaming Station & Radeon RX Vega 56 Nano

Thunderbolt 3 has enabled a number of interesting use-cases that were simply not possible with earlier high-speed external interfaces. The technology allows for four lanes of PCIe 3.0 to become available over a USB Type-C interface, which can be further combined with power, DisplayPort video, and other forms of data. As a result, one of the most prominent use-cases for Thunderbolt 3 has been using it to attach an external GPU. DIY enthusiasts have previously tried this with Thunderbolt 2 enclosures, but, there was no official support from the vendors. This changed with Thunderbolt 3 and the creation of an official eGFX standard.

These days, a number of eGFX enclosures are already available in the market. For today’s review we’re taking a look at PowerColor’s Gaming Station eGFX enclosure and their Radeon RX Vega 56 Nano GPU. Along with looking at the eGFX setup itself, we’re also using the chance to take a look at identifying how the performance of the same eGFX solution can vary across systems with different capabilities, to give us an idea of how much the host system influences performance versus GPU or bandwidth bottlenecks.

Source: AnandTech – Exploring Thunderbolt 3 eGFX Performance, Feat. PowerColor’s Gaming Station & Radeon RX Vega 56 Nano

Cosemi Launches USB 3.1 Gen 2 Hybrid Active Optical Cable: Up to 50 Meters of USB

Cosemi has introduced the industry’s first USB 3.1 Gen 2 hybrid active optical cables (hAOC), which enable USB connectivity over distances upwards of 50 meters. The cables will be available with various connectors and therefore will be able to address various applications.

As you might guess from the name, Cosemi’s USB 3.1 Gen 2 hybrid active optical cables use fiber optics for data transfers, which is further paired with copper wires for control and power. The data portion of the cable is fully USB SuperSpeed+ capable, meaning it can transfer 10Gbps in each direction. Notable, since hAOCs can power themselves, unlike other solutions they do not need any extension boxes or repeaters, making them simpler and more reliable. Using fiber for the data channel also means that the cables are more resistant against EM and RF interference, which is particularly important for medical applications.

The manufacturer plans to offer hAOCs with various types of connectors, including USB Type-A to USB Type-A, USB Type-A to USB Type-C, as well as USB Type-C to USB Type-C, with A-to-C cables being the first type out the door. And while the cables are best geared for high bandwidth applications, like copper USB 3.1 Gen 2 cables, the hybrid active optical cables are backwards compatible with the USB 2.0 spec.

Last but not least, it’s interesting to note that Cosemi’s hAOCs do not use PVC. As it turns out, this is a requirement for in-wall cables in the Americas, EMEA and Asia, as PVC produces toxic smoke when it burns.

Cosemi’s USB 3.1 Gen 2 hybrid active optical cables are sampling today, and mass production is set to start in March. The devices will be available later this year from various Cosemi’s partners, including Amazon, Liberty AV Solutions, and other. The manufacturer is not setting an MSRP quite yet, but tells us to expect them to be “competitive to USB extension box solutions.”

Related Reading:

Source: Cosemi

Source: AnandTech – Cosemi Launches USB 3.1 Gen 2 Hybrid Active Optical Cable: Up to 50 Meters of USB

Corsair 192 GB DDR4 kits for W-3175X Listed Online: Up to $3000

Corsair has released a range of 192 GB DDR4 kits to complement the workstation-focused Intel Xeon W-3175X processor which features 28 cores. The top kit from the new line-up Corsair Vengeance LPX 192 GB operates at DDR4-4000 with a latency of CL19 and has a price tag of $3000.

Using its characteristic heatsink design, Corsair has equipped its 192 GB kits with the Vengeance LPX low profile heat spreaders which are constructed with anodized aluminum and feature an all-black design. Each kit comes supplied with two Vengeance Airflow cooling systems catering for both sides of the ROG Dominus Extreme motherboard; this is the only motherboard that supports the Intel Xeon W-3175X at present.

The four kits available are rated at DDR4-2666 CL16, DDR4-3200 CL16, DDR4-3600 CL18, and DDR4-4000 CL19. Each 192 GB kit consists of twelve 16 GB sticks which operate in hexa-channel mode on the Xeon W-3175X and other LGA3647 CPUs that allow for UDIMM operation. On the DDR4-2666 kit, the operating voltage is at 1.20 V, with the faster kits requiring 1.35 V to run at their rated specifications.

Corsair Vengeance LPX 192 GB Kits for Intel Xeon W-3175X
Speed CL Timing Voltage Kit


DDR4-2666 CL16 18-18-35 1.20 V 12×16 GB CMK192GX4M12P2666C16 $1585
DDR4-3200 CL16 18-18-36 1.35 V CMK192GX4M12P3200C16 $1720
DDR4-3600 CL18 19-19-39 CMK192GX4M12P3600C18 $2320
DDR4-4000 CL19 23-23-45 CMK192GX4M12P4000C19 $3000

The four Corsair Vengeance LPX kits are available for purchase directly from the Corsair Store, with each kit occupying a different price point. The cheapest 192 GB kit is the DDR4-2666 CL16 with a cost $1585, while the next fastest, the DDR4-3200 CL has an MSRP of $1720. Moving up to the DDR4-3600 CL18 kit, it costs $2320 and unsurprisingly, the DDR4-4000 CL19 kit is the most expensive with a mouth-watering price tag of $3000.

All four kits on Corsair’s website are currently listed as ‘notify me when in stock’, so it will be interesting so see when they will be in stock and how many units will be available.

Related Reading

Source: AnandTech – Corsair 192 GB DDR4 kits for W-3175X Listed Online: Up to 00

Tiny at $200: ASUS Z390-I Gaming vs. ASRock Z390 Gaming-ITX/ac Review

With the popularity of small form factor systems ever increasing, today we reviewing two of the most attractive and high-end mini-ITX motherboards on the Z390 chipset which sit happily in an optimum price bracket. Both the ASUS ROG Strix Z390-I Gaming and the ASRock Z390 Phantom Gaming-ITX/ac are around the $200 mark, which is a very popular enthusiast price point for small form factor high powered motherboards. Both motherboards also share similar features, including dual M.2 slots for storage and 802.11ac Wave 2 Wi-Fi modules. Nonetheless, there are differences between the two worth examining.

Source: AnandTech – Tiny at 0: ASUS Z390-I Gaming vs. ASRock Z390 Gaming-ITX/ac Review

AMD Releases Radeon Pro Software for Enterprise 19.Q1: Adds Limited Support for Consumer Radeon Cards

This week, AMD released their Radeon Pro Software for Enterprise 19.Q1 WHQL.

Headlining this release, on the heels of the launch of the prosumer-oriented Radeon VII, AMD is introducing Radeon Pro Software compatibility for many of their consumer parts. Under the program, certain Radeon consumer cards, including R5 300, R7, and RX series products will be able to install the Radeon Pro drivers. These products, in turn will be able to access certain professional features of the Radeon Pro drivers, but lack the all-critical certifications and optimizations that typically set the Pro drivers apart. Meanwhile for the new Radeon VII, AMD has announced that support is due soon, but isn’t available at lanch.

More on enterprise matters, similar to the continual push for day-0 video game support in AMD’s regular Radeon Software, the company is stressing their efforts in day-0 ISV certification for professional applications. By AMD’s count, 431 application/OS/device configuration certifications are included in 19.Q1, largely covering the Radeon Pro WX series but also some FirePro cards as well. AMD also cites year-over-year improvements in CAD/workstation software, as seen in SPECviewperf 13 performance increases over Radeon Pro Software Enterprise Edition 18.Q1.

19.Q1 additionally improves AMD Remote Workstation to fully support Citrix Virtual Apps and Desktops, as well as bringing support for workstation wireless VR in Unreal Studio and SolidWorks eDrawings. This quarterly release also integrates Virtual Super Resolution into a professional feature called Radeon Pro Image Boost, which looks to improve image quality by scaling down an image rendered at higher than native resolution (up to 5K).

And lastly on their eGPU technology, AMD XConnect with Radeon ProRender support allows acceleration by both internal GPU and external Radeon Pro GPU for certain configurations.

Bugfixes and Resolved Issues

As expected, 19.Q1 also comes with fixes for the following issues:

  • Some color corruption issues seen in Adobe Premiere Pro with 10 bit pixel format
  • Flashing corruption issues with Adobe Photoshop
  • Issues with video playback with 10 bit pixel format
  • Radeon Pro Settings does not launch after driver install
  • “No AMD graphics driver is installed” popup error on switching from Gaming Mode to Professional Mode

Known Issues

AMD notes that Multi-GPU Eyefinity Pro on Windows 10 is only currently supported on the Radeon Pro WX 7100.

  • Some display issues may be observed While switching to latest drivers of gaming/professional mode
  • Applications using DOPP may experience some issues with Display Overlap enabled
  • Some rendering issues may be observed in a multi-display scenario with VMware while hot plugging
  • Users may encounter issues when creating compute intensive explosions with previous generation AMD FirePro products in Houdini

The updated drivers for AMD’s professional workstation GPUs are available online at the AMD’s professional graphics driver download page. More information on this update and further issues can be found in the Radeon Pro Software for Enterprise 19.Q1 summary notes, as well as full release notes.

Source: AnandTech – AMD Releases Radeon Pro Software for Enterprise 19.Q1: Adds Limited Support for Consumer Radeon Cards