Following up on its launch of the Ryzen 7 5800X3D in the consumer sector, AMD today unveiled its 3rd Gen EPYC “Milan-X” processors for the data center with similar stacked 3D V-cache enhancements and chip packaging technology. Compared to its non-stacked 3rd Gen EPYC processors, AMD is claiming up to a massive 66 performance uplift across

Source: Hot Hardware – AMD Unveils 3rd Gen EPYC Milan-X Data Center CPUs With 3D V-Cache For A Huge Performance Uplift