There’s been lot of talk about Intel’s 14nm Comet Lake and 10nm Tiger Lake processor architectures in recent months, but there’s another revolutionary chip architecture also waiting in the wings: Lakefield. Lakefield uses Intel’s Foveros 3D stacking technology and is built on the 10nm process node.

Tech sleuth TUM_APISAK located a UserBenchmark

Source: Hot Hardware – Intel’s Core i5-L16G7 Lakefield 3D Foveros CPU Spotted In Benchmark Leak