“One of the interesting disclosures here at the IEEE International Electron Devices Meeting (IEDM) has been around new and upcoming process node technologies.”…

Intel’s MFG Roadmap 2019 – 2029: Back Porting, 7nm, 5nm, 3nm, 2nm, and 1.4

Source: [H]ardOCP – Intel’s MFG Roadmap 2019 – 2029: Back Porting, 7nm, 5nm, 3nm, 2nm, and 1.4