Intel is providing a sneak peek (in rendered form) of its upcoming Lakefield processor family, which is based off its new Foveros three-dimensional stacked packaging technology that it detailed during its Architecture Day in Los Altos last December. While fine grain details are still under lock and key, a short video clip gives us a broad

Source: Hot Hardware – Intel Details Lakefield SoC With 10nm Sunny Cove CPU, Gen 11 Graphics, Foveros 3D Packaging