Huawei has unveiled a new chip that the company claims can best Qualcomm’s Snapdragon 835, Apple’s custom A11 SoC, and Samsung’s Exynos family: the Kirin 970, which features an 8-core CPU and 12-Core GPU, combines the power of the cloud with the speed and responsiveness of native AI processing. The company seems to be believe that user experience can only be improved through artificial intelligence.



Built using a 10nm advanced process, the chipset packs 5.5 billion transistors into an area of only one cm². HUAWEI’s new flagship Kirin 970 is HUAWEI’s first mobile AI computing platform featuring a dedicated Neural Processing Unit (NPU). Compared to a quad-core Cortex-A73 CPU cluster, the Kirin 970’s new heterogeneous computing architecture delivers up to 25x the performance with 50x greater efficiency. Simply put, the Kirin 970 can perform the same AI computing tasks faster and with far less power. In a benchmark image recognition test, the Kirin 970 processed 2,000 images per minute, which was faster than other chips on the market.

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Source: [H]ardOCP – Huawei Unveils Kirin 970 AI Processor