Tipped for release in early 2018 for mid-range smartphones, Qualcomm’s upcoming Snapdragon 670 chipset may be built on a 10nm fab process: the SoC will come with an octa-core Kryo CPU with a different cluster setup than its predecessors. While the Snapdragon 660 and 652/653 came with 4 high-power cores and 4 low-power cores, the 670 will feature two high-power Kryo 360 cores and 6 low-power cores.



This new processor will use ARM’s DynamIQ tech, which features on the Cortex-A75 and A55. This is the successor to big.LITTLE and is much more flexible. Likewise, the GPU moves on to the next generation of Adreno — the 6-series — while the current Snapdragons use Adreno 5-series. It seems that the Snapdragon 670 will be build by Samsung on its 10nm LPP tech – a refinement of the 10nm LPE used in the current Snapdragon 835 and Exynos 8895 chips. Note: LPE and LPP refers to Low Power Early and Plus respectively.

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Source: [H]ardOCP – Snapdragon 670 Rumored to Be 10nm Chip with Next-Gen Kryo Cores