Toshiba has just announced that they will begin shipping samples of its 512 Gigabit, three-bits-per-cell, 64-layer 3D NAND (BiCS 3D). Mass production is expected to take place during the second half of 2017.

Western Digital and Toshiba engineers have used digital stacking for their sixty-four layers in order to achieve a much larger storage

Source: Hot Hardware – Toshiba Ships Samples Of 3D Flash NAND Capable Of Storing 1TB