No matter what, it’s clear at this point that the way forward for the semiconductor industry is chiplets, or “tiles” in Intel nomenclature. Piling multiple pieces of a processor onto one package brings a lot of challenges, though. One of those is the assembly of the chiplet package itself. Typically, manufacturers use organic substrates as

Source: Hot Hardware – Intel To Use Glass Substrates To Enable 10x Interconnect Density For Multi-Die Processors