TSMC Teams Up With Infineon, NXP And Bosch To Build A Chip Fab In Germany

TSMC Teams Up With Infineon, NXP And Bosch To Build A Chip Fab In Germany
The world’s largest contract chipmaker is coming to Europe with a large $11bn semiconductor plant planned to open by the end of 2027. Today, TSMC announced that it will set up its third manufacturing center outside of its home turf at a site in Dresden, Germany.

The new 300mm / 12-inch fab will be funded by TSMC, some industrial partners,

Source: Hot Hardware – TSMC Teams Up With Infineon, NXP And Bosch To Build A Chip Fab In Germany