Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize the memory industry as we know it today. Neo estimates that its 3D X-DRAM tech can achieve 128Gb density which is 8 times greater compared to today’s best solutions with DDR5 technology.

3D stacking of silicon has been

Source: Hot Hardware – NEO Semiconductor Unveils 3D X-DRAM With 8x The Density Of Rival DRAM Solutions