“Hot Chips” isn’t just the favorite snack of young people—it’s also the name of a technological symposium held yearly in Silicon Valley. We’re up to the 34th iteration of the gathering this year, and Intel is among those attending with a handful of presentations. There are some cool topics, like “Heterogenous Integration Enables FPGA Based

Source: Hot Hardware – Intel To Detail 3D Chip Packaging For Next-Gen Meteor Lake And Arrow Lake CPUs